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Reflow Oven

What is a reflow oven?

A reflow oven is a specialized heating device used in electronics manufacturing to solder surface-mount components to printed circuit boards (PCBs). It uses controlled temperature profiles to heat solder paste through specific phases - preheat, soak, reflow, and cooling - ensuring proper solder joint formation without damaging components. The oven creates consistent, reliable connections across an entire PCB simultaneously, making it essential for professional PCB assembly and prototyping.

Related Terms

Reflow Soldering

Reflow soldering is a surface-mount technology (SMT) assembly process that uses controlled heat to melt solder paste and permanently attach electronic components to printed circuit boards (PCBs). The process involves applying solder paste to PCB pads, placing components on top, then heating the entire assembly in a reflow oven through a precise temperature profile that melts and solidifies the solder joints. This automated method is the standard technique for manufacturing modern electronics, allowing for high-density component placement and consistent, reliable solder connections across the entire board simultaneously.